제품소개

Micro Solder Ball Attach System

Foot Print : 1500mm(W) x 900mm(D) x 1800mm(H)
Vision : [Top/Bottom] 5 Mega Pixel
Production Speed : 70sec/1Cycle
Solder Ball Size : Min 50㎛
Micro Solder Ball Attach System
1. 기능설명 : BOC, BGA 후면에 솔더볼을 장착하는 장비 

   ＊BOC(Board On Chip)
   ＊BGA(Ball Grid Array)